Patents for C09K 13 - Etching, surface-brightening or pickling compositions (3,392)
01/2011
01/27/2011WO2011010877A2 Etchant composition for the formation of a metal line
01/27/2011WO2011009764A1 Etchant composition and etching process for titanium-aluminum complex metal layer
01/27/2011US20110021032 Etching of AlGaInAsSb
01/27/2011US20110020970 etching or plating process and resist ink
01/25/2011US7875558 Copper or copper alloy surfaces to increase the adhesion of the copper surface to a polymeric material; multilayer printed circuit boards
01/19/2011CN1865348B Halogen-free flame-proof solvent-free insulated impregnating resin product and its preparation method
01/13/2011US20110009033 Polishing slurry for metal films and polishing method
01/13/2011US20110008967 Cmp slurry and a polishing method using the same
01/13/2011US20110008965 Polishing composition and polishing method
01/13/2011US20110008929 Aligned polymers for an organic tft
01/13/2011US20110006251 Cerium salt, producing method thereof, cerium oxide and cerium based polishing slurry
01/11/2011USRE42024 containing adjuvants, having the capability of undergoing an increase in viscosity in response to an increase in temperature, and an ability to reverse their viscosity in response to a decrease in temperature
01/06/2011WO2011002801A1 Liquid mixture to clean dielectric barrier discharge surfaces
01/06/2011US20110001082 Semiconductor manufacture component
01/06/2011US20110000876 Stripper solution and method of manufacturing liquid crystal display using the same
01/05/2011EP2268765A2 Non-selective oxide etch wet clean composition and method of use
01/05/2011CN101186827B Chromeless etching solution, method for disclosing defect and technology for processing underlay
01/04/2011CA2446063C Bis (perfluoroalkanesulfonyl)imides and their salts as surfactants/additives for applications having extreme environments and methods therefor
12/2010
12/30/2010US20100327219 Solution for forming polishing slurry, polishing slurry and related methods
12/30/2010US20100327218 Chemical solution for selectively treating or removing a deteriorated layer at a surface of an organic film, and method for using such
12/29/2010CN1899003B Etching solution, method of etching and printed wiring board
12/23/2010US20100323584 Polishing liquid for metal film and polishing method
12/23/2010US20100323522 Polishing composition and polishing method
12/23/2010US20100320457 Etching solution composition
12/23/2010US20100320416 Fluorinated sulfonamide surfactants for aqueous cleaning solutions
12/16/2010WO2010143794A1 Etching paste having doping function, and formation method of selective emitter of solar cell using same
12/16/2010US20100314576 Compositions for cmp of semiconductor materials
12/15/2010CN1803964B Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using same
12/15/2010CN101289625B Production process of dipping agent bitumen
12/14/2010US7851375 Alkaline etchant for controlling surface roughness of semiconductor wafer
12/14/2010US7850866 Peroxide (H2O2) to oxidize molydenum and copper, sulfuric acid to react with cupric oxide,and a peroxide stabilizer; concurrent etching a the multilayer to form the molybdenum layer extending outwardly from underneath an edge of the copperline; thin film transistor liquid crystal-displays
12/09/2010WO2010139390A1 Two component etching
12/09/2010US20100308258 Dispersion comprising cerium oxide and sheet silicate
12/09/2010US20100308016 Polishing composition for nickel-phosphorous memory disks
12/07/2010US7846349 comprises hydrofluoric acid (buffered), ammonium fluoride, potassium fluoride, sodium fluoride, ethylene glycol, and water, for removal of tantalum or tantalum nitride; semiconductors, photoresists
12/02/2010US20100304573 Stabilized etching solutions for cu and cu/ni layers
12/02/2010US20100301265 Polishing slurry and method of polishing
12/02/2010US20100301264 Pyrogenic oxides doped with potassium
12/02/2010US20100301263 Slurry composition for a chemical mechanical polishing process and method of manufacturing a semiconductor device using the slurry composition
12/02/2010US20100301262 Composition and process for controlling particle size of metal oxides
12/02/2010US20100301014 Polishing Composition and Polishing Method Using the Same
12/02/2010US20100301010 ETCHANT COMPOSITIONS AND ETCHING METHOD FOR METALS Cu/Mo
11/2010
11/30/2010US7842193 for barrier metal material on interlayer insulation material; polishing particles containing silicon oxide and dispersed in aqueous solution, and compound such as 1,2,3,4-tetrazole, 5-amino-1,2,3,4-tetrazole, 5-methyl-1,2,3,4-tetrazole, 1,2,3-triazole, 4-amino-1,2,3-triazole, 4,5-diamino-1,2,3-triazole
11/30/2010US7842192 Multi-component barrier polishing solution
11/30/2010US7842191 chemical mechanical polishing (CMP) copper films via slurry of polyvinylpyrrolidone, oxidizing agent, protective film-forming agent containing complexing agent (containing quinaldinic acid, quinolinic acid, and alkylbenzene sulfonate) for forming water-insoluble complex, and colloidal sol
11/25/2010US20100294983 Polishing composition
11/18/2010US20100291722 Etchant and method of manufacturing an array substrate using the same
11/18/2010US20100288725 Acid Chemistries and Methodologies for Texturing Transparent Conductive Oxide Materials
11/16/2010US7833435 Polishing agent
11/16/2010US7833431 Aqueous dispersion for CMP, polishing method and method for manufacturing semiconductor device
11/11/2010US20100282712 Etching Compositions, Methods and Printing Components
11/10/2010EP1381656B1 Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate
11/09/2010US7829852 Device having etched feature with shrinkage carryover
11/04/2010US20100275952 Selective etching of reactor surfaces
11/03/2010CN101876076A Indium oxalate dissolving agent composition
11/02/2010US7824568 High concentrate aqueous solution obtained by dissolving powdered 1 H-benzotriazole in the presence of an anionic surfactant, preferably sodium octyl sulfate, and optionally a polyacrylic acid; filtering out microparticles; improved storage stability and wear resistance; chemical mechanical polishing
10/2010
10/28/2010US20100270495 Liquid resin composition for abrasive articles
10/26/2010US7820068 Chemical assisted lapping and polishing of metals
10/26/2010US7820067 chemical mechanical polishing composition; abrasive silica particles, hydrogen peroxide, halogen compound, and benzotriazole; tantalum and copper
10/21/2010US20100267843 Mixed fluoroalkyl-alkyl surfactants
10/21/2010US20100267315 Polishing composition
10/21/2010US20100267244 Method for treating germanium surfaces and solutions to be employed therein
10/21/2010US20100267241 Process for the production of microelectromechanical systems
10/21/2010US20100264360 Use of oxidants for the processing of semiconductor wafers, use of a composition and composition therefore
10/14/2010WO2010117673A1 Glass having anti-glare surface and method of making
10/14/2010WO2010086745A8 Method of etching lanthanum-containing oxide layers
10/14/2010US20100258528 Chemical mechanical polishing of silicon carbide comprising surfaces
10/13/2010CN101015043B Method for selective etching
10/07/2010WO2010115075A1 Etchant composition and method
10/07/2010WO2010113744A1 Agent for removing conductive film and method for removing conductive film
10/07/2010US20100255681 Slurry composition and method of fabricating damascene structure using the same
10/07/2010US20100255626 high viscosity etchant and a selective etching method for photovoltaic element substrates of solar cells using the same
10/07/2010US20100252775 Method for forming an indium cap layer
10/07/2010US20100252774 Chemical mechanical polishing aqueous dispersion, method of preparing the same, chemical mechanical polishing aqueous dispersion preparation kit, and chemical mechanical polishing method
10/07/2010US20100252530 Etchant composition and method
10/06/2010CN1682354B Polishing compound composition, method for producing same and polishing method
10/06/2010CN101851145A Method for preparing 1,2,3,4-tetrachloro-hexafluoro butane
09/2010
09/30/2010US20100248495 Silicon etching liquid and etching method
09/30/2010US20100243950 Polishing agent for synthetic quartz glass substrate
09/30/2010US20100243471 Composition, method and process for polishing a wafer
09/23/2010US20100239818 Textured silicon substrate and method
09/21/2010US7799686 Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same
09/16/2010US20100233880 Chemical mechanical planarization using nanodiamond
09/16/2010US20100230631 Etching liquid composition
09/10/2010WO2010099982A1 Etching composition, in particular for silicon materials, method for characterizing defects on surfaces of such materials and process of treating such surfaces with the etching composition
09/09/2010US20100224593 Acid Corrosion Solution for Preparing Polysilicon Suede and the Applied Method of It
09/08/2010EP2226374A1 Etching composition, in particular for silicon materials, method for characterizing defects of such materials and process of treating such surfaces with etching composition
09/02/2010US20100221983 Multi-layered chemical-mechanical planarization pad
09/02/2010US20100221918 Aqueous dispersion for chemical mechanical polishing and method for preparing the same, kit for preparing aqueous dispersion for chemical mechanical polishing, and chemical mechanical polishing method for semiconductor device
08/2010
08/31/2010US7785487 used for chemical mechanical polishing comprising oxidizing agents, abrasive particles, polyvinyl pyrrolidone, antistatic agents, a phosphate compound selected from ammonium phosphate, potassium phosphate or dipotassium phosphate, ammonium chloride, citric acid and water, having a pH of at least 8
08/26/2010US20100216315 Etching composition for metal material and method for manufacturing semiconductor device by using same
08/26/2010US20100216309 Cmp polishing liquid and method for polishing substrate using the same
08/19/2010WO2010056051A3 Etching solution for a transparent conductive film
08/19/2010US20100210184 Cmp slurry for silicon film polishing and polishing method
08/19/2010US20100210109 Cmp polishing slurry and method of polishing substrate
08/19/2010US20100207058 Polishing composition
08/19/2010US20100207057 Polishing composition
08/18/2010EP2217679A1 Tetrafluoroborate compounds, compositions and related methods of use
08/18/2010EP1240673B1 Method for raw etching silicon solar cells
08/17/2010US7776231 Chemical mechanical polishing slurries, their applications and method of use thereof
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