Patents for C09K 13 - Etching, surface-brightening or pickling compositions (3,392)
10/2009
10/21/2009EP2109648A1 Chemical mechanical planarization composition, system, and method of use
10/21/2009CN100551971C Solvent free resin applied to vacuum pressure dipping technique for electrical motor in high voltage
10/20/2009US7605113 Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate
10/15/2009WO2009125099A2 Glass etching composition free from ammonium ions and from difluoride ions
10/15/2009US20090256109 Conditioning agent for the etching of enamel lesions
10/15/2009US20090256108 Conditioning agent for etching enamel lesions
10/14/2009CN100549824C Etching composition and etching processing method
10/13/2009US7601273 Polishing slurry composition and method of using the same
10/08/2009US20090253268 Post-contact opening etchants for post-contact etch cleans and methods for fabricating the same
10/08/2009US20090250656 Free Radical-Forming Activator Attached to Solid and Used to Enhance CMP Formulations
10/07/2009CN101550341A Etching solution compound for etching pattern of ITO conductive film
10/07/2009CN101550340A Etching solution for etching pattern of indium tin oxide conductive film
10/07/2009CN100547045C 抛光组合物 The polishing composition
10/06/2009US7597819 Aqueous solution of water and hydrofluoric acid, and at least one redox buffer dissolved in solution that maintains redox potential of etchant solution so that redox buffer is preferentially oxidized over structural material, wherein redox buffer comprises a thio-phosphorous-based compound
10/01/2009US20090246967 Semiconductor surface treatment agent
10/01/2009US20090246957 Polishing liquid and polishing method
10/01/2009US20090246956 Metal polishing composition and chemical mechanical polishing method
09/2009
09/24/2009US20090239380 Polishing liquid for metal and polishing method using the same
09/24/2009US20090236559 Compositions for polishing aluminum/copper and titanium in damascene structures
09/17/2009US20090233827 ortho, meta or paraaminobenzenesulfonic acid; water miscible organic solvent is selected from propylene glycol methyl ether, propylene glycol propyl ether, tri(propylene glycol) monomethyl ether, 2-(2-butoxyethoxy)ethanol, tetrahydrofurfuryl alcohol, and water to remove highly crosslinked resist
09/17/2009US20090233444 Polishing method with inert gas injection
09/17/2009US20090230085 Composition for surface modification of a heat sink and method for surface treatment of the heat sink for printed circuit boards using the same
09/17/2009US20090229758 Apparatus for generating gas plasma, gas composition for generating plasma and method for manufacturing semiconductor device using the same
09/17/2009DE102005012356B4 PAA-basiertes Ätzmittel und Verfahren, bei denen dieses Ätzmittel verwendet wird PAA-based etchant and procedures that are experiencing this etchant is used
09/16/2009EP2099877A1 Etching paste containing particles for silicon surfaces and layers
09/11/2009WO2009111719A2 Non-selective oxide etch wet clean composition and method of use
09/10/2009US20090227115 Etching solution for substrate
09/10/2009US20090227075 Etchant composition, patterning conductive layer and manufacturing flat panel, display device using the same
09/10/2009US20090224200 Polishing slurries for chemical-mechanical polishing
09/03/2009WO2009072810A3 Etchant composition for glass substrate
09/03/2009US20090221152 Etching Solution And Method For Structuring A UBM Layer System
09/03/2009US20090221145 Metal polishing slurry and chemical mechanical polishing method
09/03/2009US20090220698 Nanoparticles of rare earth oxides
09/03/2009US20090218542 Anisotropic silicon etchant composition
09/02/2009CN101519593A Wet etching solution for transparent conductive film and manufacture method thereof
09/02/2009CN101519592A Anisotropic silicon etchant composition
08/2009
08/27/2009WO2009104976A1 A method for manufacturing the patterned glass intended especially for building the solar collectors and batteries and glasshouses
08/27/2009WO2009073596A3 Formulations for cleaning memory device structures
08/27/2009US20090215275 Defect Etching of Germanium
08/27/2009US20090215270 Polishing liquid and polishing method
08/27/2009US20090215269 Integrated chemical mechanical polishing composition and process for single platen processing
08/27/2009US20090215268 Polishing process for producing damage free surfaces on semi-insulating silicon carbide wafers
08/27/2009US20090215265 Low-stain polishing composition
08/27/2009US20090212021 Compositions and methods for selective removal of metal or metal alloy after metal silicide formation
08/25/2009US7578968 Effecting biocidal activity in aqueous well fluid by blending with the fluid a biocidally-effective amount of a sulfamate stabilized, bromine-based biocide formed from a halogen source which is bromine chloride, bromine and chlorine, a source of sulfamate anions, alkali metal base, and water
08/20/2009WO2008022259A8 Solution for forming polishing slurry, polishing slurry and related methods
08/20/2009US20090209104 Polishing slurry for cmp, and polishing method
08/20/2009US20090206450 Method of manufacturing a semiconductor device, semiconductor device obtained herewith, and slurry suitable for use in such a method
08/19/2009EP2090675A1 Defect etching of germanium
08/19/2009EP2089491A1 Printable medium for etching of oxidic, transparent and conducting layers
08/19/2009EP1446460A4 Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate
08/19/2009CN101511969A Method and system for dry etching a hafnium containing material
08/19/2009CN101511532A Composition and method for polishing a sapphire surface
08/19/2009CN100529014C Aqueous phosphoric acid compositions for cleaning semiconductor devices
08/13/2009US20090203215 Metal polishing slurry and chemical mechanical polishing method
08/13/2009US20090203213 Slurry composition for chemical-mechanical polishing and method of chemical-mechanical polishing with the same
08/06/2009US20090194504 Method for producing abrasive composition
08/05/2009CN101501162A Solution for forming polishing slurry, polishing slurry and related methods
08/05/2009CN101497793A Etching agent combination for etching indium tin oxide layer and its etching method
08/05/2009CN101497684A Vegetable oil based polyurethane acrylic ester, preparing process and use thereof
07/2009
07/23/2009US20090184092 Palladium-Selective Etching Solution and Method for Controlling Etching Selectivity
07/22/2009CN100516303C Removing liquid for tungsten metal and method for removing tungsten metal using such liquid
07/21/2009US7563315 Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates
07/16/2009US20090181539 Polishing agent for semiconductor integrated circuit device, polishing method, and method for manufacturing semiconductor integrated circuit device
07/16/2009US20090179172 Polishing composition
07/15/2009CN101481616A Metal and metallic oxide etching printing ink, as well as preparation method and use thereof
07/09/2009US20090176375 Method of Etching a High Aspect Ratio Contact
07/09/2009US20090176373 Polishing agent for semiconductor integrated circuit device, polishing method, and method for manufacturing semiconductor integrated circuit device
07/09/2009US20090176372 Chemical mechanical polishing slurry and semiconductor device manufacturing method
07/09/2009US20090176022 Surface modification liquid for plastic and method of metallizing plastic surface therewith
07/09/2009US20090173910 Polishing composition
07/09/2009US20090173717 Composition and method for polishing nickel-phosphorous-coated aluminum hard disks
07/08/2009CN100510000C Method to remove iron sulfide deposits from pipe lines
06/2009
06/30/2009US7553430 using an aqueous slurry comprising dissolved ammonium dimolybdate and ammonium octamolybdate in water and an oxidizing agent; apply aqueous slurry between the copper and a polishing pad; apply a low pressure with high polish rates on the surface of semiconductor wafer
06/30/2009CA2279786C A composition and method for selectively etching a silicon nitride film
06/24/2009EP1360077A4 Compositions for cleaning organic and plasma etched residues for semiconductor devices
06/23/2009US7550092 Comprises an abrasive component, a corrosion inhibitor, a surfactant, a diacid compound, a metal residue inhibitor, for example, 1,2,3,4-butanetetracarboxylic acid, and water; eliminates problems of metal dishing and metal residue while maintaining desired polishing rate
06/18/2009US20090156008 Polishing Composition and Polishing Method Using The Same
06/18/2009US20090156006 Compositions and methods for cmp of semiconductor materials
06/17/2009EP1501916B1 Non-corrosive cleaning compositions for removing etch residues
06/11/2009WO2009073596A2 Formulations for cleaning memory device structures
06/11/2009WO2009072810A2 Etchant composition for glass substrate
06/11/2009US20090148335 Process for surface treatment of metals
06/11/2009US20090146101 Etchant for metal alloy having hafnium and molybdenum
06/10/2009CN100497509C 抛光组合物和抛光方法 Polishing composition and polishing method
06/09/2009US7544622 Passivation for cleaning a material
06/09/2009US7544307 Metal polishing liquid and polishing method using it
06/04/2009WO2009040794A4 Etching compositions, methods and printing components
06/04/2009US20090142293 Polyammonium/Polysiloxane Copolymers
06/04/2009US20090140199 Polishing compound and polishing method
06/04/2009US20090140198 Method of preparing metal oxide suspension
05/2009
05/28/2009US20090136772 Etching tape and method of fabricating array substrate for liquid crystal display using the same
05/28/2009US20090136771 Composition for preparing a surface for coating and methods of making and using same
05/28/2009US20090134122 Copper-passivating CMP compositions and methods
05/27/2009EP2061916A1 Additive for chromic acid applications
05/27/2009CN101443480A Recyclable etching solution
05/26/2009US7537709 Method for isotropic etching of copper
05/22/2009CA2705589A1 Method and composition for removing contamination from surfaces in contact with water
05/21/2009US20090127501 Polishing Composition for Silicon Wafer
05/21/2009US20090127500 Polishing composition
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