Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252)
08/2005
08/25/2005US20050183952 Electrode
08/25/2005DE102004006000A1 Conducting metallized powder, comprises core particles with a nickel film formed on the surface by metallization
08/25/2005DE102004005999A1 Conducting metallized powder, comprises core particles with a nickel film formed on the surface
08/24/2005CN1659686A 衬底处理设备和衬底处理方法 The substrate processing apparatus and a substrate processing method
08/24/2005CN1659312A Acidic solution for silver deposition and method for silver layer deposition on metal surfaces
08/24/2005CN1659311A Method for copper-plating or bronze-plating an object and liquid mixtures therefor
08/24/2005CN1659310A Method for electroless metalisation of polymer substrate
08/24/2005CN1658739A Production method of suspension board with circuit
08/24/2005CN1216292C Method for fixing biological macro molecule in common pattern on inorganic silicone material surface
08/24/2005CN1216181C Chemical replacement silver plating additive, method for making same and use thereof
08/23/2005US6933231 Methods of forming conductive interconnects, and methods of depositing nickel
08/18/2005WO2005076338A1 Use of dissolved hafnium alkoxides or zirconium alkoxides as starting materials for hafnium oxide layers and hafnium oxynitride layers or zirconium oxide layers and zirconium oxynitride layers
08/18/2005WO2005075703A1 Electroless coating methods for depositing silver-tungsten coatings, kits and products
08/18/2005WO2005075702A2 Method for depositing a metal oxide coating on a substrate
08/18/2005US20050181226 Method and apparatus for selectively changing thin film composition during electroless deposition in a single chamber
08/18/2005US20050178669 Method of electroplating aluminum
08/18/2005US20050178668 Method for depositing nickel- and chromium (VI) -free metal matte layers
08/18/2005US20050178569 Electromagnetic-shielding transparent window member and method for producing the same
08/18/2005US20050178441 Fuel pump for inter-cylinder direct fuel injection apparatus
08/18/2005DE102004001613A1 The use of an object as a shaping tool having a surface consisting in whole or in part of a composite material made of a nonmetallic substrate useful
08/17/2005EP1564314A1 Metal plating structure and method for production thereof
08/17/2005EP0859686B1 Fabricating interconnects and tips using sacrificial substrates
08/11/2005WO2005073985A1 Conductive particle and anisotropic conductive material
08/11/2005WO2005073431A1 Pretreating agent for electroless plating, method of electroless plating using the same and product of electroless plating
08/11/2005WO2005073430A2 Apparatus for electroless deposition of metals onto semiconductor substrates
08/11/2005WO2005073429A2 Method and apparatus for selectively changing thin film composition during electroless deposition in a single chamber
08/11/2005US20050175780 Acidic solution for silver deposition and method for silver layer deposition on metal surfaces
08/11/2005US20050175773 Metal/ceramic bonding member and method for producing same
08/11/2005US20050174407 Depositing solid materials
08/11/2005US20050173374 Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates
08/11/2005US20050173253 Minimizing voids and cracks from thermal shock; dispensing heat processing fluid onto substrate prior to annealing; high throughput
08/11/2005DE102004003891A1 Orientierte, mittels elektromagnetischer Strahlung strukturierbare Folie aus thermoplastischem Polyester, Verfahren zu ihrer Herstellung und ihre Verwendung Oriented, can be structured by means of electromagnetic radiation sheet of thermoplastic polyester, processes for their preparation and their use
08/11/2005DE102004002778A1 Verfahren zur Instandhaltung von Metallisierungsbädern Procedures for the maintenance of metallization
08/10/2005EP1562411A1 Metal/ceramic bonding member and method for producing same
08/10/2005EP1560665A1 Corrosion resistant coatings and method of producing
08/10/2005EP1560664A1 Nanostructured and nanoporous film compositions, structures, and methods for making the same
08/10/2005CN1652666A Method for mfg wired substrate and method for mfg electronic apparatus
08/09/2005US6926922 PWB manufacture
08/04/2005WO2005071138A1 Method for processing substrate, catalyst process liquid, and substrate processing apparatus
08/04/2005WO2003087707A3 Metallization of carbon nanotubes for field emission applications
08/04/2005US20050170652 Method for manufacturing wiring substrate and method for manufacturing electronic device
08/04/2005US20050170622 Method for manufacturing wiring substrate and method for manufacturing electronic device
08/04/2005US20050170080 single process tool; surface of semiconductor has barrier layer and conductor; two planarization modules, an electroless deposition module; conductor is planarized until a portion of the barrier layer is expose and removed; workpiece moved to electroless plating module, a cap layer is formed
08/04/2005US20050167712 Ferroelectric film, ferroelectric memory, and piezoelectric element
08/04/2005US20050167281 Production method of suspension board with circuit
08/04/2005DE4313980B4 Integrierte Hybridschaltung und Verfahren zu deren Herstellung A hybrid integrated circuit, and processes for their preparation
08/03/2005EP1559810A2 Process for the preparation of a ceramic protective layer
08/03/2005EP1559740A1 Oriented, with electromagnetic radiation patternable foil made of thermoplastic polyester, process of preparation and use
08/03/2005EP1559677A2 Mixed metal oxide layer and method of manufacture
08/03/2005EP1558794A1 Measurement of the concentration of a reducing agent in an electroless plating bath
08/03/2005EP1558786A2 Pretreatment method for electroless plating material and method for producing member having plated coating
08/03/2005EP1558785A1 Substrate coating method
08/03/2005CN1650046A Method of plating nonconductor product
08/03/2005CN1649473A Production method of suspension board with circuit
08/02/2005US6924232 Semiconductor process and composition for forming a barrier material overlying copper
08/02/2005US6923892 Method for electrodeposited film formation, method for electrode formation, and apparatus for electrodeposited film formation
08/02/2005CA2258102C Multilayer-coated powder and process for producing the same
07/2005
07/28/2005WO2005069068A1 Method for gravure printing transparent electrodes, and ink composition therefor
07/28/2005WO2005068134A1 Production method for pattern-worked porous molding or nonwoven fabric, and electric circuit components
07/28/2005US20050164499 Electroless plating method and apparatus
07/28/2005US20050164020 use of a hot-press method where ion exchange groups are introduced in a resin, metal ions are bound to said groups, and then chemically reduced to form metal at the surface of the resin in order to increase bonding strength between the metal and resin base
07/28/2005US20050163987 metal oxide or spinel capable of activation by electromagnetic radiation forms metal nuclei; graphite, carbon black, inorganic or organic black pigment absorb radiation; printed circuit boards, ribbon cables, smart cards, RFID labels, membrane keyboards, and film-based circuits
07/28/2005US20050163917 Direct writeTM system
07/28/2005US20050163916 Electroless plating systems and methods
07/28/2005US20050161338 activation of conductive surface on semiconductors and to depositing capping layers on the conductive layers as part of electronics
07/28/2005US20050160990 Apparatus for electroless deposition of metals onto semiconductor substrates
07/28/2005US20050160974 Microelectronic fabrication system components and method for processing a wafer using such components
07/28/2005DE19655326B4 Electroless nickel plating bath - containing nickel salt, reducing agent, complexing agent and a compound with sulphur to sulphur bond
07/28/2005DE102004001107A1 Strukturierung auf Oberflächen mittels Folie Structuring of surfaces by film
07/28/2005DE102004001097A1 Metallische Substrate mit verformbarer glasartiger Beschichtung Metallic Substrates with a deformable vitreous coating
07/28/2005CA2551397A1 Production method for pattern-worked porous molding or nonwoven fabric, and electric circuit components
07/27/2005EP1558067A1 Electromagnetic wave shielding light transmitting window material and process for producin the same
07/27/2005EP1557483A1 Method for forming thin silver mirror film, and method for forming coating film comprising thin silver mirror film
07/27/2005EP1557482A2 Process for the maintenance of metallization baths
07/27/2005EP1557481A2 Ferroelectric film, ferroelectric memory, and piezoelectric element
07/27/2005EP1556878A2 Enhanced field emission from carbon nanotubes mixed with particles
07/27/2005EP1556737A2 Nanometer-scale engineered structures, methods and apparatus for fabrication thereof, and applications to mask repair, enhancement, and fabrication
07/27/2005EP1556175A2 Hydrothermal deposition of thin and adherent metal oxide coatings for high temperature corrosion protection
07/27/2005EP1404746B1 Pre-treatment of plastic materials
07/27/2005CN1646728A Method for electroless deposition of a metal layer on selected portions of a substrate
07/27/2005CN1645617A Ferroelectric film, ferroelectric memory, and piezoelectric element
07/27/2005CN1644759A Surface treating method for improving lanthanum alloy vapour impurity poisoning performance
07/27/2005CN1644758A Activating method for nonmetallic base material surface chemical coated metal
07/27/2005CN1644757A Production of quantum point nanometer titanium dioxide composite membrane
07/27/2005CN1644496A Ceramics and production method therefor, and ferroelectric capacitor, semiconductor device, other elements
07/27/2005CN1212431C Method for enhancing the solderability of a surface
07/27/2005CN1212422C Preparation method of titanium dioxide bydrophilic film blended with vanadium
07/21/2005WO2005066392A2 Surface structuring by means of a film
07/21/2005WO2005066388A2 Metallic substrates comprising a deformable glass-type coating
07/21/2005WO2005065815A1 Method for coating powder particle
07/21/2005WO2005065433A2 Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates
07/21/2005WO2005065208A2 Apparatus and method for treating used electroless plating solutions
07/21/2005WO2005038082A3 Method for obtaining a composite ferro-electric material
07/21/2005US20050158478 Substrate processing apparatus and substrate processing method
07/21/2005US20050158466 Mixture containing nonionic surfactant and stabilizer compound, such as triglyme, dipivaloylmethane, pinacol, pivalic acid or hexyleneglycol; for overcoating substrate with bismuth ferrite; heat treatment; suitable for application to non-volatile ferroelectric memories; low decomposition temperature
07/21/2005US20050157396 Microstructure array, mold for forming a microstructure array, and method of fabricating the same
07/21/2005US20050156991 Maskless direct write of copper using an annular aerosol jet
07/21/2005US20050155514 Additive for plating bath
07/21/2005DE10360046A1 Kupfer(l)formiatkomplexe Formate complexes of copper (I)
07/20/2005EP1555335A2 Additive for plating bath
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