| Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252) |
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| 07/20/2005 | EP1554414A2 Aqueous alkaline zincate solutions and methods |
| 07/20/2005 | CN1641813A Method for controlling additive distribution uniformity of silver-tin anhydride electride contact material |
| 07/20/2005 | CN1641483A Method for forming metal pattern with low resistivity |
| 07/20/2005 | CN1641075A Magnesium and Mg alloy surface activating method and surface palting method |
| 07/20/2005 | CN1641070A Method for chemical plating metal for non-metal substrate surface and pretreatment system used thereof |
| 07/19/2005 | US6919283 Fabrication of pure and modified Ta2O5 thin film with enhanced properties for microwave communication, dynamic random access memory and integrated electronic applications |
| 07/19/2005 | US6919121 For use in a hostile thermal environment, such as turbine, combustor and augmentor components of a gas turbine engine. |
| 07/14/2005 | WO2005064403A1 Composition for forming nitride coating film for hard mask |
| 07/14/2005 | WO2005063612A1 Fine metal structure, process for producing the same, fine metal mold and device |
| 07/14/2005 | WO2004101856A3 Methods for electrochemically fabricating structures using adhered masks, incorporating dielectric sheets, and/or seed layers that are partially removed via planarization |
| 07/14/2005 | WO2004081261B1 Plating apparatus |
| 07/14/2005 | WO2003052164A3 Method for coating a substrate with calcium phosphate |
| 07/14/2005 | US20050153481 Method of pretreating a nonmagnetic substrate and a magnetic recording medium formed thereby |
| 07/14/2005 | US20050153171 Doped cerium oxide, zirconium oxide in colloidal suspension; spin coated on alumina substrate; dried and layered; fired and recrystalized to form electrolyte; uniformity, lower cost thin films |
| 07/14/2005 | US20050153078 Formation of solid layers on substrates |
| 07/14/2005 | US20050153061 formed at relatively low temperatures; have a relatively high capability to withstand expansion and contraction caused by heating and cooling of components; dipping dielectric material in solution of catalytic metal particles with slight electrostatic dipole |
| 07/14/2005 | US20050153059 forming very narrow metal conductor lines on a surface of a resin substrate; oxidization resin surface (patterned); treatment with metal coordinating compound; electroless plating |
| 07/14/2005 | US20050151195 Method of manufacturing a thin film transistor, thin film transistor, thin film transistor circuit, electronic device, and electronic apparatus |
| 07/14/2005 | DE10120011B4 Verfahren zum Beschichten eines dünnen Flächenkörpers mit einem Substrat A method for coating a thin sheet body with a substrate |
| 07/13/2005 | EP1553212A1 Electromagnetic wave shield material and process for producing the same |
| 07/13/2005 | EP1553068A1 Inorganic coating for ceramic ware |
| 07/13/2005 | EP1552729A2 Method for the manufacture of printed circuit boards with integral plated resistors |
| 07/13/2005 | EP1552415A2 Method and apparatus for real time monitoring of electroplating bath performance and early fault detection |
| 07/13/2005 | EP1478607B1 Method for metallizing titanate-based ceramics |
| 07/13/2005 | CN1639840A Electroless deposition apparatus |
| 07/13/2005 | CN1639385A Immersion plating of silver |
| 07/13/2005 | CN1639384A Partial plating method, partially-plated resin base, method for manufacturing multilayer circuit board |
| 07/13/2005 | CN1639383A Method for forming interconnection metal layer, method for selectively forming metal, apparatus for selectively forming metal, and substrate apparatus |
| 07/13/2005 | CN1639085A Method for metallizing titanate-based ceramics |
| 07/13/2005 | CN1637166A Methods of metallizing non-conductive substrates and metallized non-conductive substrates formed thereby |
| 07/13/2005 | CN1636698A Compound moulding method for plastic products |
| 07/13/2005 | CN1210994C Electrical device having PTC conductive polymer |
| 07/13/2005 | CN1210440C Method for chemically electroplating thick nickle on titanium alloy |
| 07/13/2005 | CN1210439C Method for mfg. electronic parts and said electronic parts |
| 07/13/2005 | CN1210438C Process for preparing lanthanum-strontium-cobalt-oxygen conductive film material |
| 07/12/2005 | US6916741 Capture compounds for electronic plating compositions and electronic packaging device manufacture |
| 07/12/2005 | US6916522 Charge-giving body, and pattern-formed body using the same |
| 07/12/2005 | CA2492341A1 Mixed metal oxide layer and method of manufacture |
| 07/07/2005 | WO2005061760A1 Method and apparatus for material deposition |
| 07/07/2005 | WO2005061218A1 Aluminum phosphate compounds, compositions, materials and related metal coatings |
| 07/07/2005 | WO2005040447A3 Thin metal oxide film and method of making the same especially for fuel cells |
| 07/07/2005 | WO2005038085A3 Selective self-initiating electroless capping of copper with cobalt-containing alloys |
| 07/07/2005 | WO2004101014A3 Deposition products, composite materials and processes for the production thereof |
| 07/07/2005 | WO2003057943A3 Electroless plating system |
| 07/07/2005 | US20050148197 Substrate proximity processing structures and methods for using and making the same |
| 07/07/2005 | US20050148174 Contact-connection of nanotubes |
| 07/07/2005 | US20050147762 Method to fabricate amorphous electroless metal layers |
| 07/07/2005 | US20050147755 Method for metal plating and pre-treating agent |
| 07/07/2005 | US20050147746 Nanotube growth and device formation |
| 07/07/2005 | US20050145939 Thin film forming apparatus |
| 07/07/2005 | US20050145498 Apparatus and method for treating used electroless plating solutions |
| 07/07/2005 | US20050145133 Copper molybdenum electroless deposition process and materials |
| 07/07/2005 | CA2546628A1 Aluminum phosphate compounds, compositions, materials and related metal coatings |
| 07/07/2005 | CA2545700A1 Method and system for forming a film of material using plasmon assisted chemical reactions |
| 07/06/2005 | EP1551070A1 Composite current collector |
| 07/06/2005 | EP1550739A1 Plated polyester resin article and method for production thereof |
| 07/06/2005 | EP1495157B1 Method for copper-plating or bronze-plating an object and liquid mixtures therefor |
| 07/06/2005 | CN1636305A Method for coating chemical device and chemical device element |
| 07/06/2005 | CN1636081A Electroless plating system |
| 07/06/2005 | CN1636080A Method for coating a substrate with calcuim phosphate |
| 07/06/2005 | CN1209814C Process for the manufacture of printed circuit board with plated resistor |
| 07/06/2005 | CN1209494C Process for preparing single crystal silicon substrate surface self-assembly rare earth nano-film |
| 07/06/2005 | CN1209440C Composition containing azacyclic compound and glycol for grain decoration of resin material, removal of stain and removal of resin material |
| 07/06/2005 | CN1209287C Process for preparing silica or silica-based thick vitreous films according to sol-gel technique and thick films thereby obtained |
| 07/06/2005 | CN1209216C Making process of composite iron-in-copper powder |
| 07/05/2005 | US6913828 Production of hollow metal microcylinders from lipids |
| 07/05/2005 | US6913651 Apparatus and method for electroless deposition of materials on semiconductor substrates |
| 07/05/2005 | US6913468 Methods of removably mounting electronic components to a circuit board, and sockets formed by the methods |
| 06/30/2005 | WO2005059204A2 Rolling bearing having a nickel-phosphorus coating |
| 06/30/2005 | WO2005058789A2 Copper (i) formate complexes |
| 06/30/2005 | WO2005044451A9 Electrical connection of components |
| 06/30/2005 | WO2005031035A3 Method for producing thin semiconductor films by deposition from solution |
| 06/30/2005 | WO2004105096A3 Method of making barrier layers |
| 06/30/2005 | US20050142839 Conductive layers and fabrication methods thereof |
| 06/30/2005 | US20050141830 Methods of metallizing non-conductive substrates and metallized non-conductive substrates formed thereby |
| 06/30/2005 | US20050141150 Electrical connection of components |
| 06/30/2005 | DE10317797B4 Rapid Prototyping-Verfahren Rapid prototyping methods |
| 06/30/2005 | CA2549526A1 Rolling bearing having a nickel-phosphorus coating |
| 06/29/2005 | EP1548152A1 Electrode forming method |
| 06/29/2005 | EP1547040A2 Method of fabricating a magnetic tag |
| 06/29/2005 | EP1546437A2 Thin films of oxidic materials having a high dielectric constant |
| 06/29/2005 | EP1546435A1 Method for pretreating a surface of a non-conducting material to be plated |
| 06/29/2005 | EP1546056A2 Article having nano-scaled structures and a process for making such article |
| 06/29/2005 | CN1633523A Method for forming a micro-pattern on a substrate by using capillary force |
| 06/29/2005 | CN1633521A Precious metal recovery |
| 06/29/2005 | CN1633520A Plating device and method |
| 06/29/2005 | CN1632167A Process for preparing diamond-like coating containing nano gold particles |
| 06/29/2005 | CN1208852C Method for coating nucleic acid with metal by means of non-field produced metal nanoparticles |
| 06/29/2005 | CN1208139C Low etch alkaline zincate composition and process for zincating aluminum |
| 06/28/2005 | US6911269 Lead-free chemical nickel alloy |
| 06/28/2005 | US6911230 Improving the adhesion of gold deposited layer on nickel metal substrate or layer, by electroless depositing a pre-seeding layer of palladium in small amount |
| 06/28/2005 | US6911127 Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces |
| 06/28/2005 | US6911067 Solution composition and method for electroless deposition of coatings free of alkali metals |
| 06/23/2005 | WO2005056875A2 Formation of solid layers on substrates |
| 06/23/2005 | WO2005056067A1 Silver coatings and methods of manufacture |
| 06/23/2005 | WO2005047213A3 Oxidation inhibition of carbon-carbon composites |
| 06/23/2005 | US20050136654 Multiple stage electroless deposition of a metal layer |
| 06/23/2005 | US20050136193 Selective self-initiating electroless capping of copper with cobalt-containing alloys |
| 06/23/2005 | US20050136185 Post rinse to improve selective deposition of electroless cobalt on copper for ULSI application |
| 06/23/2005 | DE10354760A1 Verfahren zur Abscheidung von Nickel und Chrom(VI)freien metallischen Mattschichten A process for the deposition of nickel and chromium (VI) free metallic mat layers |